Idizayini yokukhipha ukushisa inweba impilo yesevisi ye-LED.Indlela yokukhetha nokusebenzisa izinto zokushisa ukushisa?

Onjiniyela bangathuthukisa ukusebenza kahle nempilo yesevisi ye-led ngokulawulwa okuphumelelayo kokukhipha ukushisa.Ukukhetha ngokucophelela izinto zokukhipha ukushisa nezindlela zokufaka isicelo kubaluleke kakhulu.

Kudingeka sicabangele isici esibalulekile ekukhethweni komkhiqizo - ukusetshenziswa kwezinto zokulawula ukuchithwa kokushisa.Kungakhathaliseki ukuthi inhlanganisela yokupakisha noma into yesixhumi esibonakalayo, noma iliphi igebe endaweni eqhuba ukushisa lizoholela ekwehlisweni kwezinga lokukhipha ukushisa.

Ukuze uthole i-thermal conductive packaging resin, isihluthulelo sempumelelo siwukuqinisekisa ukuthi i-resin ingageleza izungeze iyunithi, kuhlanganise nokungena noma iyiphi igebe elincane.Lokhu kugeleza okufanayo kusiza ukususa noma yiziphi izikhala zomoya futhi kuqinisekisa ukuthi akukho ukushisa okukhiqizwa kuyo yonke iyunithi.Ukuze kuzuzwe lolu hlelo lokusebenza, i-resin idinga ukuguqulwa kwe-thermal okulungile kanye ne-viscosity.Ngokuvamile, njengoba conductivity eshisayo ye-resin ikhula, i-viscosity nayo iyanda.

Ngezinto ezisetshenziswayo zokusebenzelana, i-viscosity yomkhiqizo noma ubukhulu obuncane obungaba khona ngesikhathi sokufaka isicelo kunomthelela omkhulu ekuphikisweni kokushisa.Ngakho-ke, uma kuqhathaniswa nemikhiqizo enomthamo ophansi we-thermal conductivity kanye ne-viscosity ephansi, izinhlanganisela ezine-conductivity ephezulu ye-thermal kanye ne-viscosity ephezulu azikwazi ukusabalalisa ngokulinganayo phezulu, kodwa zibe nokumelana nokushisa okuphezulu kanye nokusebenza kahle kokukhipha ukushisa okuphansi.Ukuze kwandiswe ukusebenza kahle kokudluliswa kokushisa, abasebenzisi badinga ukuxazulula izinkinga ze-conductivity eqoqiwe ye-thermal, ukumelana nokuxhumana, ukushuba kwesicelo kanye nenqubo.

Ngokuthuthuka okusheshayo kwemboni ye-elekthronikhi, ikakhulukazi, ku-ukusetshenziswa kwe-LED, ubuchwepheshe bezinto ezibonakalayo kufanele futhi buhlangabezane nezidingo zokushisa eziphakeme neziphakeme.Lobu buchwepheshe manje sebudluliselwe kuma-packaging compounds ukuze kuhlinzekwe imithwalo ephezulu ye-filler yemikhiqizo, ngaleyo ndlela kuthuthukiswe ukuqhutshwa kwe-thermal kanye ne-liquidity.


Isikhathi sokuthumela: Jul-21-2022