1. Uhlolojikelele lwesimo samanje sobuchwepheshe sisonke sama-LED asekelwe ku-silicon

Ukukhula kwezinto ze-GaN kuma-silicon substrates kubhekene nezinselelo ezimbili ezinkulu zobuchwepheshe.Okokuqala, ukungafani kwe-lattice okufika ku-17% phakathi kwe-silicon substrate ne-GaN kubangela ukuminyana okuphezulu kokuhlukaniswa ngaphakathi kwezinto ze-GaN, okuthinta ukusebenza kahle kwe-luminescence;Okwesibili, kukhona ukungezwani okushisayo okufika ku-54% phakathi kwe-silicon substrate ne-GaN, okwenza amafilimu e-GaN athambekele ekuqhekekeni ngemva kokukhula kwezinga lokushisa eliphezulu futhi ehlele ekamelweni, okuthinta isivuno sokukhiqiza.Ngakho-ke, ukukhula kwesendlalelo se-buffer phakathi kwe-silicon substrate nefilimu encane ye-GaN kubaluleke kakhulu.Isendlalelo sebhafa sidlala indima ekwehliseni ukuminyana kokususwa ngaphakathi kwe-GaN kanye nokunciphisa ukuqhekeka kwe-GaN.Ngokwezinga elikhulu, izinga lobuchwepheshe lesendlalelo se-buffer linquma ukusebenza kahle kwe-quantum yangaphakathi kanye nesivuno sokukhiqizwa kwe-LED, okugxilwe kuyo nobunzima be-silicon-based.I-LED.Kuze kube manje, ngokutshalwa kwezimali okukhulu ocwaningweni nasekuthuthukisweni okuvela embonini nasezikhungweni zemfundo ephakeme, le nselelo yezobuchwepheshe isinqotshiwe.

I-silicon substrate imunca kakhulu ukukhanya okubonakalayo, ngakho ifilimu ye-GaN kufanele idluliselwe kwenye i-substrate.Ngaphambi kokudlulisa, isibonisi esikhanyayo esiphezulu sifakwa phakathi kwefilimu ye-GaN nenye i-substrate ukuze kuvinjelwe ukukhanya okukhishwa yi-GaN ekumunceni i-substrate.Isakhiwo se-LED ngemva kokudluliswa kwe-substrate saziwa embonini njenge-Thin Film chip.Ama-chips amafilimu azacile anezinzuzo ngaphezu kwama-chips esakhiwo esisemthethweni ngokuya ngokusabalaliswa kwamanje, ukuqhutshwa kwe-thermal, kanye nokufana kwamabala.

2. Uhlolojikelele lwesimo sohlelo lokusebenza sisonke kanye nombono wemakethe wama-LED we-silicon substrate

Ama-LED asekelwe ku-silicon anesakhiwo esime mpo, ukusatshalaliswa okufanayo kwamanje, nokusabalalisa okusheshayo, okuwenza afanelekele izinhlelo zokusebenza zamandla aphezulu.Ngenxa yokuphuma kwayo kokukhanya ohlangothini olulodwa, isiqondiso esihle, kanye nekhwalithi enhle yokukhanya, ifaneleka ngokukhethekile ukukhanyisa kweselula njengokukhanyisa kwezimoto, izibani zokusesha, amalambu ezimayini, amalambu akhanyisa amaselula, nezinkambu zokukhanyisa eziphezulu ezinezidingo zekhwalithi yokukhanya okuphezulu. .

Ubuchwepheshe kanye nenqubo ye-Jingneng Optoelectronics silicon substrate LED isivuthiwe.Ngesisekelo sokuqhubeka nokugcina izinzuzo eziholayo emkhakheni we-silicon substrate ukukhanya okuluhlaza okwesibhakabhaka kwama-chips e-LED, imikhiqizo yethu iyaqhubeka nokunwebeka ezinkambu zokukhanyisa ezidinga ukukhanya okuqondisayo kanye nokuphumayo kwekhwalithi ephezulu, njengama-chips amhlophe e-LED asebenza kakhulu kanye nenani elingeziwe. , izibani ze-flash zefoni ephathekayo ye-LED, izibani zemoto ye-LED, izibani zomgwaqo ze-LED, ukukhanya kwe-LED, njll., kancane kancane kusungula isikhundla esizuzisayo se-silicon substrate LED chips embonini ehlukene.

3. Ukubikezela kwethrendi yentuthuko ye-silicon substrate LED

Ukuthuthukisa ukusebenza kahle kokukhanya, ukunciphisa izindleko noma ukusebenza kahle kwezindleko kuyitimu yaphakade kuImboni ye-LED.I-silicon substrate yefilimu encane yama-chips kufanele ihlanganiswe ngaphambi kokuthi isetshenziswe, futhi izindleko zama-akhawunti okupakisha ingxenye enkulu yezindleko zohlelo lwe-LED.Yeqa ukupakishwa okuvamile futhi upakishe ngokuqondile izingxenye ku-wafer.Ngamanye amazwi, ukupakishwa kwesikali se-chip (CSP) ku-wafer kungeqa isiphetho sokupakisha futhi kungene ngokuqondile ekugcineni kohlelo lokusebenza kusukela ekugcineni kwe-chip, kuqhubeke kwehlisa izindleko zohlelo lokusebenza lwe-LED.I-CSP ingelinye lamathemba ama-LED asuselwa ku-GaN ku-silicon.Izinkampani zamazwe ngamazwe ezifana ne-Toshiba ne-Samsung zibike ukuthi zisebenzisa ama-LED asekelwe ku-silicon e-CSP, futhi kukholakala ukuthi imikhiqizo ehlobene izotholakala maduze emakethe.

Eminyakeni yamuva nje, enye indawo eshisayo embonini ye-LED yiMicro LED, eyaziwa nangokuthi i-micrometer level LED.Usayizi wama-Micro LEDs usuka kuma-micrometer ambalwa ukuya kumashumi ama-micrometer, acishe abe sezingeni elifanayo nogqinsi lwamafilimu amancane e-GaN akhuliswe i-epitaxy.Esikalini se-micrometer, izinto ze-GaN zingenziwa ngokuqondile zibe yi-GaNLED emiswe mpo ngaphandle kwesidingo sosekelo.Okusho ukuthi, ohlelweni lokulungiselela ama-Micro LED, i-substrate yokukhula kwe-GaN kufanele isuswe.Inzuzo engokwemvelo yama-LED asekelwe ku-silicon ukuthi i-silicon substrate ingasuswa nge-chemical wet etching iyodwa, ngaphandle komthelela ezintweni ze-GaN phakathi nenqubo yokususa, ukuqinisekisa isivuno nokuthembeka.Kusukela kulo mbono, ubuchwepheshe be-silicon substrate LED kufanele bube nendawo emkhakheni wama-Micro LEDs.