Ukusebenza okukhanyayo kokujulaI-UV LEDikakhulukazi kunqunywa ukusebenza kahle kwe-quantum yangaphandle, okuthintwa ukusebenza kahle kwe-quantum yangaphakathi nokusebenza kahle kokukhipha ukukhanya. Ngokuthuthuka okuqhubekayo (>80%) kokusebenza kahle kwequantum yangaphakathi ye-UV LED ejulile, ukusebenza kahle kokukhishwa kokukhanya kwe-UV LED ejulile sekuyinto ebalulekile ekhawulela ukuthuthukiswa kokukhanya kwe-UV LED ejulile, kanye nokusebenza kahle kokukhipha ukukhanya I-LED ye-UV ejulile ithintwa kakhulu ubuchwepheshe bokupakisha. Ubuchwepheshe bokupakisha be-UV LED obujulile buhlukile kobuchwephesha bamanje bokupakisha be-LED obumhlophe. I-LED emhlophe ikakhulukazi ihlanganiswe nezinto eziphilayo (i-epoxy resin, ijeli ye-silica, njll.), kodwa ngenxa yobude begagasi lokukhanya kwe-UV elijulile namandla aphezulu, izinto eziphilayo zizokonakala ngaphansi kwemisebe ye-UV ejulile yesikhathi eside, ethinta kakhulu. ukusebenza kahle kokukhanya nokuthembeka kwe-UV LED ejulile. Ngakho-ke, ukufakwa okujulile kwe-UV LED kubaluleke kakhulu ekukhetheni izinto zokwakha.

Izinto zokupakisha ze-LED ikakhulukazi zifaka izinto ezikhipha ukukhanya, izinto ze-substrate zokushabalalisa ukushisa nezinto zokubopha i-welding. Izinto ezikhipha ukukhanya zisetshenziselwa ukukhipha i-chip luminescence, ukulawula ukukhanya, ukuvikelwa kwemishini, njll; I-substrate yokushisa ukushisa isetshenziselwa ukuxhumanisa ugesi we-chip, ukuchithwa kokushisa nokusekelwa kwemishini; Izinto zokubopha i-welding zisetshenziselwa ukuqina kwe-chip, ukubopha amalensi, njll.

1. impahla ekhipha ukukhanya:iUkukhanya kwe-LEDisakhiwo esikhiphayo ngokuvamile samukela izinto ezibonakalayo ukuze sibone ukuphuma nokulungiswa kokukhanya, kuyilapho kuvikela i-chip kanye nongqimba lwesekethe. Ngenxa yokumelana nokushisa okungekuhle kanye nokushisisa okuphansi kwezinto eziphilayo, ukushisa okukhiqizwe yi-chip ye-UV LED ejulile kuzobangela ukuthi izinga lokushisa likhuphuke, futhi izinto eziphilayo zizowohloka ngokushisa, ukuguga okushisayo kanye ne-carbonization engenakuhlehliswa. ngaphansi kokushisa okuphezulu isikhathi eside; Ukwengeza, ngaphansi kwemisebe ye-ultraviolet enamandla amakhulu, ungqimba lwamaphakheji wezinto eziphilayo luzoba nezinguquko ezingenakuhlehliswa ezifana nokuncipha kokudluliswa kwemishini nama-microcracks. Ngokukhula okuqhubekayo kwamandla e-UV ajulile, lezi zinkinga ziba zimbi kakhulu, okwenza kube nzima ngezinto zemvelo zendabuko ukuhlangabezana nezidingo zephakeji ejulile ye-UV LED. Ngokuvamile, nakuba ezinye izinto eziphilayo kuye kwabikwa ukuthi ziyakwazi ukumelana nokukhanya kwe-ultraviolet, ngenxa yokumelana nokushisa okungekuhle nokungangeni komoya kwezinto eziphilayo, izinto eziphilayo zisanqunyelwe ekujuleni kwe-UV.Ukupakishwa kwe-LED. Ngakho-ke, abacwaningi bahlala bezama ukusebenzisa izinto ezingaphili ezingabonakali njengengilazi ye-quartz nesafire ukupakisha i-UV LED ejulile.

2. izinto ze-substrate zokulahla ukushisa:okwamanje, izinto ze-LED zokushisa ukushisa kwe-substrate ikakhulukazi zifaka i-resin, insimbi ne-ceramic. Kokubili i-resin ne-metal substrates iqukethe ungqimba lwe-organic resin insulation, oluzonciphisa ukuqhutshwa kokushisa kwe-substrate yokukhipha ukushisa futhi kuthinte ukusebenza kokukhipha ukushisa kwe-substrate; Ama-Ceramic substrates ikakhulukazi ahlanganisa izinga lokushisa eliphezulu/eliphansi izinga lokushisa le-ceramic substrates (HTCC/ltcc), ama-substrates e-ceramic aminyene yefilimu (TPC), ama-copper-clad ceramic substrates (DBC) kanye nama-electroplated ceramic substrates (DPC). Ama-substrates e-Ceramic anezinzuzo eziningi, njengamandla aphezulu emishini, ukufakwa kahle, ukuqhutshwa kwe-thermal conductivity, ukumelana nokushisa okuhle, i-coefficient ephansi yokwanda okushisayo nokunye. Zisetshenziswa kakhulu ekufakweni kwedivayisi yamandla, ikakhulukazi ukupakishwa kwe-LED enamandla amakhulu. Ngenxa yokusebenza kahle kokukhanya okuphansi kwe-UV LED ejulile, amandla kagesi amaningi okufakwayo aguqulwa abe ukushisa. Ukuze ugweme ukulimala kwezinga lokushisa eliphezulu ku-chip okubangelwa ukushisa okukhulu, ukushisa okukhiqizwa i-chip kudinga ukuchithwa endaweni ezungezile ngesikhathi. Kodwa-ke, i-UV LED ejulile incike ngokuyinhloko ku-substrate yokukhipha ukushisa njengendlela yokusingatha ukushisa. Ngakho-ke, i-thermal conductivity ephezulu ye-ceramic substrate iyisinqumo esihle se-substrate yokukhipha ukushisa yokufaka okujulile kwe-UV LED.

3. Izinto zokubopha i-welding:izinto zokushisela ezijulile ze-UV LED zifaka i-chip solid crystal materials nezinto zokushisela ze-substrate, ezisetshenziswa ngokulandelana ukuqaphela ukushisela phakathi kwe-chip, ikhava yengilazi (i-lens) ne-ceramic substrate. Ku-flip chip, indlela ye-Gold Tin eutectic ivame ukusetshenziselwa ukubona ukuqina kwe-chip. Kuma-chips avundlile naqondile, iglue esiliva e-conductive kanye ne-lead-free solder paste ingasetshenziswa ukuqedela ukuqiniswa kwe-chip. Uma kuqhathaniswa neglue esiliva kanye ne-solder-free solder paste, amandla okubopha i-Gold Tin eutectic aphezulu, ikhwalithi yesixhumi esibonakalayo yinhle, futhi ukuqhutshwa kokushisa kwesendlalelo sokubopha kuphezulu, okunciphisa ukumelana nokushisa kwe-LED. Ipuleti lekhava yengilazi lishiselwe ngemva kokuqina kwe-chip, ngakho-ke izinga lokushisa lokushisela lilinganiselwe izinga lokushisa lokumelana lesendlalelo sokuqina kwe-chip, ikakhulukazi okuhlanganisa ukubopha okuqondile kanye ne-solder bonding. Ukubopha okuqondile akudingi izinto zokuhlanganisa ezimaphakathi. Ukushisa okuphezulu kanye nendlela yokucindezela okuphezulu isetshenziselwa ukuqedela ngokuqondile ukushisela phakathi kwepuleti lesembozo sengilazi kanye ne-ceramic substrate. Isixhumi esibonakalayo sokubopha siyisicaba futhi sinamandla amakhulu, kodwa sinezidingo eziphezulu zemishini nokulawula inqubo; I-solder bonding isebenzisa i-solder esekelwe kuthayela osezingeni eliphansi njengongqimba olumaphakathi. Ngaphansi kwesimo sokushisa nokucindezela, ukubopha kuqedwa ukuhlukaniswa kwama-athomu phakathi kwesendlalelo se-solder kanye nongqimba lwensimbi. Izinga lokushisa lenqubo liphansi futhi ukusebenza kulula. Njengamanje, i-solder bonding ivame ukusetshenziselwa ukubona ukuhlangana okuthembekile phakathi kwepuleti lekhava yengilazi kanye ne-ceramic substrate. Kodwa-ke, izingqimba zensimbi zidinga ukulungiswa ebusweni be-glass cover plate kanye ne-ceramic substrate ngesikhathi esifanayo ukuze kuhlangatshezwane nezidingo ze-welding yensimbi, nokukhethwa kwe-solder, ukumbozwa kwe-solder, ukuchichima kwe-solder kanye nezinga lokushisa lokushisela kudingeka kucatshangelwe inqubo yokubopha. .

Eminyakeni yamuva nje, abacwaningi basekhaya nakwamanye amazwe benze ucwaningo olunzulu ngezinto zokupakisha ezijulile ze-UV LED, okuye kwathuthukisa ukusebenza kahle okukhanyayo nokuthembeka kwe-UV LED ejulile ngokombono wobuchwepheshe bezinto zokupakisha, futhi kwakhuthaza ngempumelelo ukuthuthukiswa kwe-UV ejulile. Ubuchwepheshe be-LED.