Yinii-chip eholayo? Ngakho yiziphi izici zayo? Ukwenziwa kwama-chip e-LED ngokuyinhloko ukukhiqiza ama-electrode okuxhumana e-ohmic asebenzayo futhi anokwethenjelwa, ukuhlangabezana nokwehla kwamandla kagesi amancane phakathi kwezinto ezithintekayo, ukuhlinzeka ngamaphedi okucindezela izintambo zokushisela, futhi kukhiphe ukukhanya ngangokunokwenzeka. Inqubo yokuguqula ifilimu ngokuvamile isebenzisa indlela yokuhwamuka kwe-vacuum. Ngaphansi kwe-vacuum engu-4pa ephezulu, impahla incibilikiswa ngokushisisa kokumelana noma indlela yokushisa ye-electron beam bombardment, futhi i-bZX79C18 iba umhwamuko wensimbi futhi ifakwe phezu kwempahla ye-semiconductor ngaphansi kwengcindezi ephansi.

Ngokuvamile, insimbi yokuxhumana yohlobo lwe-p esetshenziswayo ihlanganisa i-Aube, i-auzn namanye ama-alloys, futhi insimbi yokuxhumana no-n-side ivame ukusebenzisa i-AuGeNi alloy. Isendlalelo sokuxhumana se-electrode kanye nesendlalelo se-alloy esiveziwe singahlangabezana ngokuphumelelayo nezidingo zenqubo ye-lithography. Ngemuva kwenqubo ye-photolithography, kubuye kube ngenqubo ye-alloying, evame ukuqhutshwa ngaphansi kokuvikelwa kwe-H2 noma i-N2. Isikhathi se-alloying kanye nezinga lokushisa kuvame ukunqunywa ngokuya ngezimpawu zezinto zokwakha ze-semiconductor kanye nesimo sesithando somlilo we-alloy. Yiqiniso, uma inqubo ye-chip electrode efana nohlaza okwesibhakabhaka nokuluhlaza iyinkimbinkimbi kakhulu, ukukhula kwefilimu okungenzi lutho kanye nenqubo yokufaka i-plasma kudingeka kwengezwe.

Enqubweni yokukhiqiza i-chip ye-LED, iyiphi inqubo enomthelela obalulekile ekusebenzeni kwayo kwe-photoelectric?

Ngokuvamile, ngemva kokuqedwa kweUkukhiqizwa kwe-epitaxial ye-LED, izakhiwo zayo zikagesi eziyinhloko ziphothuliwe, futhi ukukhiqizwa kwe-chip ngeke kushintshe isimo sawo senuzi, kodwa izimo ezingalungile ohlelweni lokuhlanganisa nokuhlanganisa zizobangela imingcele engalungile kagesi. Isibonelo, izinga lokushisa eliphansi noma eliphezulu le-alloying lizodala ukuthintana kahle kwe-ohmic, okuyisizathu esiyinhloko sokwehla kwe-voltage eya phambili ephezulu ye-VF ekukhiqizeni ama-chip. Ngemuva kokusika, uma izinqubo zokugqwala zenziwa onqenqemeni lwe-chip, kuzosiza ukuthuthukisa ukuvuza okuphambene kwe-chip. Lokhu kungenxa yokuthi ngemva kokusika ngensimbi yesondo lokugaya idayimane, imfucumfucu eyengeziwe nempushana izohlala emaphethelweni e-chip. Uma lezi zinamathele ekuhlanganeni kwe-PN kwe-chip ye-LED, zizobangela ukuvuza kukagesi ngisho nokuphuka. Ngaphezu kwalokho, uma i-photoresist endaweni ye-chip ingakhumulwanga ihlanzekile, izodala ubunzima phambi kwe-welding kanye nokushisela okungamanga. Uma ingemuva, izophinde ibangele ukwehla komfutho ophezulu. Enqubweni yokukhiqiza ama-chip, amandla okukhanya angathuthukiswa ngokukhuhla indawo engaphezulu futhi ayihlukanise ibe isakhiwo se-trapezoidal esihlanekezelwe.

Kungani ama-chips e-LED kufanele ahlukaniswe ngamasayizi ahlukene? Iyini imiphumela yosayizi ekusebenzeni kwe-photoelectric ye-LED?

Usayizi we-chip we-LED ungahlukaniswa ube yi-chip enamandla aphansi, i-chip yamandla aphakathi nendawo kanye ne-high-power chip ngokusho kwamandla. Ngokwezidingo zamakhasimende, ingahlukaniswa ngezinga leshubhu elilodwa, izinga ledijithali, izinga le-matrix yamachashazi kanye nokukhanyisa kokuhlobisa. Ngokuqondene nosayizi othize we-chip, kunqunywa ngokwezinga langempela lokukhiqiza labakhiqizi abahlukene be-chip, futhi akukho mfuneko ethile. Uma nje inqubo idlula, i-chip ingathuthukisa okukhiphayo kweyunithi futhi inciphise izindleko, futhi ukusebenza kwe-photoelectric ngeke kushintshe ngokuyisisekelo. Ukusetshenziswa kwamanje kwe-chip empeleni kuhlobene nokuminyana kwamanje okugeleza ku-chip. Lapho i-chip incane, ukusetshenziswa kwamanje kuncane, futhi lapho i-chip inkulu, ukusetshenziswa kwamanje kukhulu. Ukuminyana kweyunithi yabo kwamanje kuyafana. Uma kucatshangelwa ukuthi ukuchithwa kokushisa kuyinkinga eyinhloko ngaphansi kwamandla aphezulu, ukusebenza kahle kwayo okukhanyayo kuphansi kuneyamanje ephansi. Ngakolunye uhlangothi, njengoba indawo ikhula, ukumelana komzimba we-chip kuzokwehla, ngakho-ke ukuhamba phambili kwe-voltage kuzokwehla.

Ingakanani indawo ye-chip yamandla aphezulu we-LED? Kungani?

Ama-chips anamandla aphezulungoba ukukhanya okumhlophe kuvame ukuba ngu-40mil emakethe. Okubizwa ngokuthi amandla okusebenzisa ama-chips anamandla aphezulu ngokuvamile kubhekisela kumandla kagesi angaphezu kuka-1W. Njengoba ukusebenza kahle kwe-quantum ngokuvamile kungaphansi kwama-20%, iningi lamandla kagesi lizoguqulwa libe amandla okushisa, ngakho-ke ukuchithwa kokushisa kwe-chip yamandla aphezulu kubaluleke kakhulu, futhi i-chip iyadingeka ukuze ibe nendawo enkulu.

Yiziphi izidingo ezihlukene zobuchwepheshe be-chip kanye nemishini yokucubungula yokukhiqiza izinto ze-GaN epitaxial uma kuqhathaniswa ne-gap, i-GaAs ne-InGaAlP? Kungani?

Ama-substrates ama-chips ajwayelekile e-LED abomvu naphuzi kanye nama-Quad abomvu naphuzi agqamile enziwe ngezinto ezihlanganisiwe ze-semiconductor njenge-gap nama-GaAs, ngokuvamile angenziwa abe ama-substrates ohlobo lwe-n. Inqubo emanzi isetshenziselwa i-lithography, bese i-blade yesondo lokugaya idayimane isetshenziselwa ukusika i-chip. I-chip eluhlaza okwesibhakabhaka yezinto ze-GaN i-substrate yesafire. Ngenxa yokuthi i-sapphire substrate ifakwe i-insulated, ayikwazi ukusetshenziswa njengesigxobo esisodwa se-LED. Kuyadingeka ukwenza ama-electrode we-p / N endaweni ye-epitaxial ngasikhathi sinye ngenqubo yokuqopha okomile, kanye nezinqubo ezithile zokudlula. Ngenxa yokuthi isafire inzima kakhulu, kunzima ukudweba ama-chips ngensimbi yesondo lokugaya idayimane. Inqubo yayo yezobuchwepheshe ngokuvamile ingaphezulu futhi iyinkimbinkimbi kunaleyo ye-LED eyenziwe nge-gap kanye ne-GaAs materials.

Siyini isakhiwo nezici ze-chip "electrode esobala"?

I-electrode ebizwa ngokuthi i-transparent kufanele ibe conductive futhi ibonakale. Le nto manje isetshenziswa kabanzi kunqubo yokukhiqiza i-crystal liquid. Igama layo yi-indium tin oxide, efushanisiwe njenge-ITO, kodwa ayikwazi ukusetshenziswa njengephedi ye-solder. Ngesikhathi sokwenziwa, i-electrode ye-ohmic izokwenziwa ebusweni be-chip, bese ungqimba lwe-ITO luzombozwa phezulu, bese ungqimba lwe-welding pad lubekwe phezu kwe-ITO. Ngale ndlela, i-current from lead isatshalaliswa ngokulinganayo ku-electrode yokuxhumana ye-ohmic ngayinye ngesendlalelo se-ITO. Ngesikhathi esifanayo, ngenxa yokuthi inkomba ye-refractive ye-ITO iphakathi kwe-refractive index of air and epitaxial material, i-angle yokukhanya ingathuthukiswa futhi i-flux ekhanyayo ingandiswa.

Iyini inkambiso yobuchwepheshe be-chip bokukhanyisa kwe-semiconductor?

Ngokuthuthukiswa kobuchwepheshe be-semiconductor LED, ukusetshenziswa kwayo emkhakheni wokukhanyisa kuyanda, ikakhulukazi ukuvela kwe-LED emhlophe kuye kwaba indawo eshisayo yokukhanyisa kwe-semiconductor. Kodwa-ke, i-chip eyisihluthulelo nobuchwepheshe bokupakisha budinga ukuthuthukiswa. Mayelana ne-chip, kufanele sithuthuke sibheke emandleni aphezulu, ukusebenza kahle okuphezulu okukhanyayo nokunciphisa ukumelana nokushisa. Ukwandisa amandla kusho ukuthi ukusetshenziswa kwamanje kwe-chip kuyanda. Indlela eqondile kakhulu ukukhulisa usayizi we-chip. Manje ama-chips avamile aphezulu angu-1mm × 1mm noma kunjalo, futhi ukusebenza kwamanje kungu-350mA Ngenxa yokwanda kokusetshenziswa kwamanje, inkinga yokukhipha ukushisa ibe yinkinga evelele. Manje le nkinga ngokuyisisekelo ixazululwa ngendlela ye-chip flip. Ngokuthuthukiswa kobuchwepheshe be-LED, ukusetshenziswa kwayo emkhakheni wokukhanyisa kuzobhekana nethuba elingakaze libonwe kanye nenselelo.

Yini i-flip chip? Sinjani isakhiwo sawo? Yiziphi izinzuzo zayo?

I-Blue LED ngokuvamile isebenzisa i-Al2O3 substrate. I-Al2O3 substrate inobulukhuni obuphezulu kanye ne-thermal conductivity ephansi. Uma yamukela isakhiwo esisemthethweni, ngakolunye uhlangothi, izoletha izinkinga eziphikisana ne-static; ngakolunye uhlangothi, ukuchithwa kokushisa kuzoba yinkinga enkulu ngaphansi kwamandla aphezulu. Ngesikhathi esifanayo, ngenxa yokuthi i-electrode yangaphambili iphezulu, ukukhanya okuthile kuzovinjelwa, futhi ukusebenza kahle okukhanyayo kuzoncishiswa. I-LED enamandla aluhlaza okwesibhakabhaka ingathola ukukhanya okuphumayo okusebenzayo ngobuchwepheshe be-chip flip chip kunobuchwepheshe bokupakisha bendabuko.

Njengamanje, indlela yokwakheka kwe-flip chip evamile yilena: okokuqala, lungisa i-chip ye-LED enosayizi omkhulu oluhlaza okwesibhakabhaka ene-eutectic welding electrode, lungisa i-silicon substrate enkulu kancane kune-chip ye-LED eluhlaza okwesibhakabhaka, futhi wenze ungqimba lwegolide lokuqhuba bese uhola ungqimba locingo ( i-ultrasonic wire ball solder joint) yokushisela i-eutectic kuyo. Ngemuva kwalokho, i-chip ye-LED enamandla amakhulu aluhlaza kanye ne-silicon substrate zishiselwa ndawonye ngemishini yokushisela ye-eutectic.

Isici salesi sakhiwo ukuthi ungqimba lwe-epitaxial luthintana ngokuqondile ne-silicon substrate, futhi ukumelana nokushisa kwe-silicon substrate kuphansi kakhulu kune-sapphire substrate, ngakho-ke inkinga yokushisa ukushisa ixazululwa kahle. Ngenxa yokuthi i-sapphire substrate ibheke phezulu ngemva kokufakwa kwe-flip, iba indawo ekhipha ukukhanya, futhi isafire ibonakala ngale, ngakho inkinga yokukhipha ukukhanya nayo iyaxazululwa. Okungenhla ulwazi olufanele lobuchwepheshe be-LED. Ngikholelwa ukuthi ngokuthuthukiswa kwesayensi nobuchwepheshe, izibani ze-LED zesikhathi esizayo zizoba ngcono nakakhulu, futhi impilo yesevisi izothuthukiswa kakhulu, okuzosilethela ukukhululeka okukhulu.